Industry Leaders to Discuss Latest Innovations & Trends at SEMICON Taiwan 2010

More than 30 executives from leading semiconductor companies will present the technology innovations and discuss the outlook for 2011 at SEMICON Taiwan 2010. 

● Market Briefing : Semiconductor Market Outlook
Analysts from UBS, Morgan Stanley, Gartner, Yole Développement and SEMI will give you an update on DRAM, foundry and equipment & materials market. >> Detailed Agenda

● IC Executive Forum : Technology Advancement through Innovative Collaboration
Speakers from TSMC, MXIC, TEL, IMEC, Ebara and Dow Electronics Materials will address topics focusing on technology advancement through innovative collaboration. >> Detailed Agenda

● 3D IC Technology Forum : The Coming-of-age of 2.5D & 3D ICs
Presentations from Applied Materials, ASE, IMEC, Nokia, Qualcomm, SPIL, UMC, SEMATECH, Verigy and Yole Développement will share their experiences in 2.5D and 3D ICs with a special emphasis on emerging business models, manufacturing readiness and roadmap. >> Detailed Agenda

● MEMS Forum : Enhancing Global Competitiveness of MEMS Eco-system
Speakers from ASE, EV Group IMEC, InvenSense, Multitest, National Chip Implementation Center, Qualcomm, STMicroelectronics and SUSS MicroOptics, Touch Micro-system will share their experiences on design, packaging, testing and manufacturing to enhance global competitiveness of MEMS eco-system. >> Detailed Agenda

● CMP Forum : Exploring Customized Frontier CMP
Speakers from Cabot, Dow Electronic Materials, Praxair, and Saint-Gobain Abrasives will address the topics of advanced CMP solutions for the integration of high-k metal gate technologies, erosion control in copper CMP processes and high-volume IC production. >> Detailed Agenda